MEMS actuation systems and methods

ABSTRACT

A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

RELATED CASE(S)

This application claims the benefit of the following U.S. ProvisionalApplication No. 62/393,436 filed on 12 Sep. 2016, 62/393,419 filed on 12Sep. 2016, 62/419,117 filed on 8 Nov. 2016, 62/419,814 filed on 9 Nov.2016, and 62/420,960 filed on 11 Nov. 2016; their contents of which areincorporated herein by reference.

TECHNICAL FIELD

This disclosure relates to actuators in general and, more particularly,to miniaturized MEMS actuators configured for use within camerapackages.

BACKGROUND

As is known in the art, actuators may be used to convert electronicsignals into mechanical motion. In many applications such as e.g.,portable devices, imaging-related devices, telecommunicationscomponents, and medical instruments, it may be beneficial for miniatureactuators to fit within the small size, low power, and cost constraintsof these application.

Micro-electrical-mechanical system (MEMS) technology is the technologythat in its most general form may be defined as miniaturized mechanicaland electro-mechanical elements that are made using the techniques ofmicrofabrication. The critical dimensions of MEMS devices may vary fromwell below one micron to several millimeters. In general, MEMS actuatorsare more compact than conventional actuators, and they consume lesspower.

SUMMARY OF DISCLOSURE

Invention #4

In one implementation, a method of manufacturing amicro-electrical-mechanical system (MEMS) assembly includes mounting amicro-electrical-mechanical system (MEMS) actuator to a metal plate. Animage sensor assembly is mounted to the micro-electrical-mechanicalsystem (MEMS) actuator. The image sensor assembly is electricallycoupled to the micro-electrical-mechanical system (MEMS) actuator, thusforming a micro-electrical-mechanical system (MEMS) subassembly.

One or more of the following features may be included. Mounting amicro-electrical-mechanical system (MEMS) actuator to a metal plate mayinclude applying epoxy to the metal plate, positioning themicro-electrical-mechanical system (MEMS) actuator on the epoxy, andcuring the epoxy. Mounting an image sensor assembly to themicro-electrical-mechanical system (MEMS) actuator may include applyingepoxy to the micro-electrical-mechanical system (MEMS) actuator,positioning the image sensor on the epoxy, and curing the epoxy.Electrically coupling the image sensor assembly to themicro-electrical-mechanical system (MEMS) actuator may includewirebonding the image sensor assembly to the micro-electrical-mechanicalsystem (MEMS) actuator. The micro-electrical-mechanical system (MEMS)subassembly may be mounted to a printed circuit board. Mounting themicro-electrical-mechanical system (MEMS) subassembly to a printedcircuit board may include applying epoxy to the printed circuit board,positioning the micro-electrical-mechanical system (MEMS) subassembly onthe epoxy, and curing the epoxy. The micro-electrical-mechanical system(MEMS) subassembly may be electrically coupled to the printed circuitboard. Electrically coupling the micro-electrical-mechanical system(MEMS) subassembly to the printed circuit board may include wirebondingthe micro-electrical-mechanical system (MEMS) subassembly to the printedcircuit board. Electrically coupling the micro-electrical-mechanicalsystem (MEMS) subassembly to the printed circuit board further mayinclude encapsulating the wirebonding in epoxy. A holder assembly may bemounted to the micro-electrical-mechanical system (MEMS) subassembly.Mounting a holder assembly to the micro-electrical-mechanical system(MEMS) subassembly may include applying epoxy to the printed circuitboard, positioning the holder assembly on the epoxy, and curing theepoxy.

In another implementation, a method of manufacturing amicro-electrical-mechanical system (MEMS) assembly includes mounting amicro-electrical-mechanical system (MEMS) actuator to a metal plate. Animage sensor assembly is mounted to the micro-electrical-mechanicalsystem (MEMS) actuator. The image sensor assembly is electricallycoupled to the micro-electrical-mechanical system (MEMS) actuator, thusforming a micro-electrical-mechanical system (MEMS) subassembly. Themicro-electrical-mechanical system (MEMS) subassembly is mounted to aprinted circuit board. The micro-electrical-mechanical system (MEMS)subassembly is electrically coupled to the printed circuit board.

One or more of the following features may be included. Mounting amicro-electrical-mechanical system (MEMS) actuator to a metal plate mayinclude: applying epoxy to the metal plate, positioning themicro-electrical-mechanical system (MEMS) actuator on the epoxy, andcuring the epoxy. Mounting an image sensor assembly to themicro-electrical-mechanical system (MEMS) actuator may include: applyingepoxy to the micro-electrical-mechanical system (MEMS) actuator,positioning the image sensor on the epoxy, and curing the epoxy.Electrically coupling the image sensor assembly to themicro-electrical-mechanical system (MEMS) actuator may includewirebonding the image sensor assembly to the micro-electrical-mechanicalsystem (MEMS) actuator. Mounting the micro-electrical-mechanical system(MEMS) subassembly to a printed circuit board may include: applyingepoxy to the printed circuit board, positioning themicro-electrical-mechanical system (MEMS) subassembly on the epoxy, andcuring the epoxy. Electrically coupling the micro-electrical-mechanicalsystem (MEMS) subassembly to the printed circuit board may include:wirebonding the micro-electrical-mechanical system (MEMS) subassembly tothe printed circuit board, and encapsulating the wirebonding in epoxy. Aholder assembly may be mounted to the micro-electrical-mechanical system(MEMS) subassembly. Mounting a holder assembly to themicro-electrical-mechanical system (MEMS) subassembly may include:applying epoxy to the printed circuit board, positioning the holderassembly on the epoxy, and curing the epoxy.

In another implementation, a method of manufacturing amicro-electrical-mechanical system (MEMS) assembly includes: mounting amicro-electrical-mechanical system (MEMS) actuator to a metal plate,mounting an image sensor assembly to the micro-electrical-mechanicalsystem (MEMS) actuator, electrically coupling the image sensor assemblyto the micro-electrical-mechanical system (MEMS) actuator, thus forminga micro-electrical-mechanical system (MEMS) subassembly, mounting themicro-electrical-mechanical system (MEMS) subassembly to a printedcircuit board, electrically coupling the micro-electrical-mechanicalsystem (MEMS) subassembly to the printed circuit board; and mounting aholder assembly to the micro-electrical-mechanical system (MEMS)subassembly.

The details of one or more implementations are set forth in theaccompanying drawings and the description below. Other features andadvantages will become apparent from the description, the drawings, andthe claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a package in accordance with variousembodiments of the present disclosure;

FIG. 2A is a diagrammatic view of an in-plane MEMS actuator with theoptoelectronic device in accordance with various embodiments of thepresent disclosure;

FIG. 2B is a perspective view of an in-plane MEMS actuator with theoptoelectronic device in accordance with various embodiments of thepresent disclosure;

FIG. 3A is a diagrammatic view of an in-plane MEMS actuator inaccordance with various embodiments of the present disclosure;

FIGS. 3B-3C are diagrammatic views of a coupling assembly includedwithin the in-plane MEMS actuator of FIG. 3A in accordance with variousembodiments of the present disclosure;

FIG. 4 is a diagrammatic view of a comb drive sector in accordance withvarious embodiments of the present disclosure;

FIG. 5 is a diagrammatic view of a comb pair in accordance with variousembodiments of the present disclosure;

FIG. 6A is a diagrammatic view of fingers of the comb pair of FIG. 5 inaccordance with various embodiments of the present disclosure;

FIG. 6B-6F are diagrammatic views of a cantilever stress reductionsystem in accordance with various embodiments of the present disclosure;

FIG. 6G-6L are diagrammatic views of a finger array snubbing system inaccordance with various embodiments of the present disclosure;

FIG. 7 is a diagrammatic view of a combination of an in-plane MEMSactuator and an out-of-plane actuator in accordance with variousembodiments of the present disclosure;

FIG. 8 is a diagrammatic view of an out-of-plane actuator in accordancewith various embodiments of the present disclosure;

FIG. 9A is a cross-sectional view of a two-actuator package inaccordance with various embodiments of the present disclosure;

FIG. 9B is a cross-sectional detail view of a two-actuator package inaccordance with various embodiments of the present disclosure;

FIG. 10 is a cross-sectional detail view of a deformed out-of-planeactuator in accordance with various embodiments of the presentdisclosure;

FIG. 11 is a cross-sectional view of an actuation beam of the deformedout-of-plane actuator of FIG. 10 in accordance with various embodimentsof the present disclosure;

FIG. 12 is a cross-sectional view of a package including a singleactuator in accordance with various embodiments of the presentdisclosure;

FIGS. 13A-13B are perspective view of a holder assembly in accordancewith various embodiments of the present disclosure;

FIG. 14 is a flowchart of a method of assembling a package including asingle actuator in accordance with various embodiments of the presentdisclosure;

FIG. 15 is a flowchart of a method of assembling a package includingmultiple actuators in accordance with various embodiments of the presentdisclosure;

FIG. 16 is a diagrammatic view of a zipper actuator in accordance withvarious embodiments of the present disclosure;

FIGS. 17A-17C are diagrammatic views of alternative embodiments of thezipper actuator of FIG. 16 in accordance with various embodiments of thepresent disclosure;

FIGS. 18A-18B are diagrammatic views of alternative embodiments of thezipper actuator of FIG. 16 in accordance with various embodiments of thepresent disclosure; and

FIGS. 19A-19C are diagrammatic views of slidable connection assembliesin accordance with various embodiments of the present disclosure.

Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

System Overview:

Referring to FIG. 1, there is shown MEMS package 10, in accordance withvarious aspects of this disclosure. In this example, package 10 is shownto include printed circuit board 12, micro-electrical-mechanical system(MEMS) assembly 14, driver circuits 16, electronic components 18,flexible circuit 20, and electrical connector 22.Micro-electrical-mechanical system (MEMS) assembly 14 may includemicro-electrical-mechanical system (MEMS) actuator 24 and optoelectronicdevice 26 mounted to micro-electrical-mechanical system (MEMS) actuator24.

Examples of micro-electrical-mechanical system (MEMS) actuator 24 mayinclude but are not limited to an in-plane MEMS actuator, anout-of-plane MEMS actuator, and a combination in-plane/out-of-plane MEMSactuator. For example and if micro-electrical-mechanical system (MEMS)actuator 24 is an in-plane MEMS actuator, the in-plane MEMS actuator mayinclude an electrostatic comb drive actuation system (as will bediscussed below in greater detail). Additionally, ifmicro-electrical-mechanical system (MEMS) actuator 24 is an out-of-planeMEMS actuator, the out-of-plane MEMS actuator may include apiezoelectric actuation system or electrostatic actuation. And ifmicro-electrical-mechanical system (MEMS) actuator 24 is a hybridin-plane/out-of-plane MEMS actuator, the combinationin-plane/out-of-plane MEMS actuator may include an electrostatic combdrive actuation system and a piezoelectric actuation system.

As will be discussed below in greater detail, examples of optoelectronicdevice 26 may include but are not limited to an image sensor, a holderassembly, a UV filter, an autofocus assembly and/or a lens assembly.Examples of electronic components 18 may include but are not limited tovarious electronic or semiconductor components and devices. Flexiblecircuit 20 and/or connector 22 may be configured to electrically coupleMEMS package 10 to e.g., a smart phone or a digital camera (representedas generic item 28).

As will be discussed below in greater detail,micro-electrical-mechanical system (MEMS) actuator 24 may be sized sothat it may fit within a recess in printed circuit board 12. The depthof this recess within printed circuit board 12 may vary depending uponthe particular embodiment and the physical size ofmicro-electrical-mechanical system (MEMS) actuator 24.

In some embodiments, some of the components of MEMS package 10 may bejoined together using various epoxies/adhesives. For example and as willbe discussed below in greater detail, an outer frame ofmicro-electrical-mechanical system (MEMS) actuator 24 may includecontact pads that may correspond to similar contact pads on printedcircuit board 12.

Referring also to FIG. 2A, there is shown micro-electrical-mechanicalsystem (MEMS) assembly 14, which may include optoelectronic device 26mounted to micro-electrical-mechanical system (MEMS) actuator 24.Micro-electrical-mechanical system (MEMS) actuator 24 may include outerframe 30, plurality of electrically conductive flexures 32, MEMSactuation core 34 for attaching a payload (e.g., a device), and attachedoptoelectronic device 26. Optoelectronic device 26 may be affixed toMEMS actuation core 34 of micro-electrical-mechanical system (MEMS)actuator 24 by epoxy (or various other adhesives/materials and/orbonding methods).

Referring also to FIG. 2B, plurality of electrically conductive flexures32 of micro-electrical-mechanical system (MEMS) actuator 24 may becurved upward and buckled to achieve the desired level of flexibility.In the illustrated embodiment, plurality of electrically conductiveflexures 32 may have one end attached to MEMS actuation core 34 (e.g.,the moving portion of micro-electrical-mechanical system (MEMS) actuator24) and the other end attached to outer frame 30 (e.g., the fixedportion of micro-electrical-mechanical system (MEMS) actuator 24).

Plurality of electrically conductive flexures 32 may be conductive wiresthat may extend above the plane (e.g., an upper surface) ofmicro-electrical-mechanical system (MEMS) actuator 24 and mayelectrically couple laterally separated components ofmicro-electrical-mechanical system (MEMS) actuator 24. For example,plurality of electrically conductive flexures 32 may provide electricalsignals from optoelectronic device 26 and/or MEMS actuation core 34 toouter frame 30 of micro-electrical-mechanical system (MEMS) actuator 24.As discussed above, outer frame 30 of micro-electrical-mechanical system(MEMS) actuator 24 may be affixed to circuit board 12 using epoxy (orvarious other adhesive materials or devices).

Referring also to FIG. 3A, there is shown a top view ofmicro-electrical-mechanical system (MEMS) actuator 24 in accordance withvarious embodiments of the disclosure. Outer frame 30 is shown toinclude (in this example) four frame assemblies (e.g., frame assembly100A, frame assembly 100B, frame assembly 100C, frame assembly 100D)that are shown as being spaced apart to allow for additional detail.However and during assembly, frame assembly 100A, frame assembly 100B,frame assembly 100C and frame assembly 100D may be coupled (or latched)together to form outer frame 30 (as will be discussed below in greaterdetail). Conversely and in other embodiments, frame assembly 100A, frameassembly 100B, frame assembly 100C and frame assembly 100D may not bejoined together and may be left as separate assemblies (although this istypically not the case).

Outer frame 30 of micro-electrical-mechanical system (MEMS) actuator 24may include a plurality of contact pads (e.g., contact pads 102A onframe assembly 100A, contact pads 102B on frame assembly 100B, contactpads 102C on frame assembly 100C, and contact pads 102D on frameassembly 100D), which may be electrically coupled to one end ofplurality of electrically conductive flexures 32. The curved shape ofelectrically conductive flexures 32 is provided for illustrativepurposes only and, while illustrating one possible embodiment, otherconfigurations are possible and are considered to be within the scope ofthis disclosure.

MEMS actuation core 34 may include a plurality of contact pads (e.g.,contact pads 104A, contact pads 104B, contact pads 104C, contact pads104D), which may be electrically coupled to the other end of pluralityof electrically conductive flexures 32. A portion of the contact pads(e.g., contact pads 104A, contact pads 104B, contact pads 104C, contactpads 104D) of MEMS actuation core 34 may be electrically coupled tooptoelectronic device 26 by wire bonding, silver paste, or eutecticseal, thus allowing for the electrical coupling of optoelectronic device26 to outer frame 30.

MEMS actuation core 34 may include one or more comb drive sectors (e.g.,comb drive sector 106) that are actuation sectors disposed withinmicro-electrical-mechanical system (MEMS) actuator 24. The comb drivesectors (e.g., comb drive sector 106) within MEMS actuation core 34 maybe disposed in the same plane and may be positioned orthogonal to eachother to allow for movement in two axes (e.g., the x-axis and they-axis).

While in this particular example, MEMS actuation core 34 is shown toinclude four comb drive sectors, this is for illustrative purposes onlyand is not intended to be a limitation of this disclosure, as otherconfigurations are possible. For example, the number of comb drivesectors may be increased or decreased depending upon design criteria.

While in this particular example, the four comb drive sectors are shownto be generally square in shape, this is for illustrative purposes onlyand is not intended to be a limitation of this disclosure, as otherconfigurations are possible. For example, the shape of the comb drivesectors may be changed to meet various design criteria.

Each comb drive sector (e.g., comb drive sector 106) within MEMSactuation core 34 may include one or more moving portions and one ormore fixed portions. As will be discussed below in greater detail, acomb drive sector (e.g., comb drive sector 106) within MEMS actuationcore 34 may be coupled, via a cantilever assembly (e.g., cantileverassembly 108), to outer periphery 110 of MEMS actuation core 34 (i.e.,the portion of MEMS actuation core 34 that includes contact pads 104A,contact pads 104B, contact pads 104C, contact pads 104D), which is theportion of MEMS actuation core 34 to which optoelectronic device 26 maybe coupled, thus effectuating the transfer of movement to optoelectronicdevice 26.

Multi-Piece Outer Frame (Invention #6)

As discussed above, outer frame 30 is shown to include (in this example)four frame assemblies (e.g., frame assembly 100A, frame assembly 100B,frame assembly 100C, frame assembly 100D) that are shown as being spacedapart to allow for additional detail. However, during assembly, frameassembly 100A, frame assembly 100B, frame assembly 100C, and frameassembly 100D may be coupled together to form outer frame 30.

Accordingly and referring also to FIGS. 3B-3C,micro-electrical-mechanical system (MEMS) actuator 24 may include MEMSactuation core 34, and a multi-piece MEMS electrical connector assembly(e.g., outer frame 30) electrically coupled to MEMS actuation core 34and configured to be electrically coupled to printed circuit board 12.Multi-piece MEMS electrical connector (e.g., outer frame 30) mayinclude: a plurality of subcomponents (e.g., frame assembly 100A, frameassembly 100B, frame assembly 100C, frame assembly 100D), and aplurality of coupling assemblies (e.g., coupling assembly 112)configured to couple the plurality of subcomponents together (e.g.,frame assembly 100A, frame assembly 100B, frame assembly 100C, frameassembly 100D).

While FIGS. 3B-3C only shows frame assembly 100A and frame assembly 100Dbeing coupled together using coupling assembly 112, this is forillustrative purposes only. For example, frame assembly 100A and frameassembly 100B may be coupled using another coupling assembly; frameassembly 100B and frame assembly 100C may be coupled using anothercoupling assembly; and frame assembly 100C and frame assembly 100D maybe coupled using another coupling assembly.

As discussed above, plurality of electrically conductive flexures 32 ofmicro-electrical-mechanical system (MEMS) actuator 24 may be curvedupward and buckled to achieve the desired level of flexibility.Specifically, plurality of electrically conductive flexures 32 may beconfigured to be generally flat in shape when the plurality ofsubcomponents (e.g., frame assembly 100A, frame assembly 100B, frameassembly 100C, frame assembly 100D) are uncoupled. And prior toattaching micro-electrical-mechanical system (MEMS) actuator 24 toprinted circuit board 12, frame assembly 100A, frame assembly 100B,frame assembly 100C, frame assembly 100D may be coupled together.Further, plurality of electrically conductive flexures 32 may beconfigured to be generally arched in shape when the plurality ofsubcomponents (e.g., frame assembly 100A, frame assembly 100B, frameassembly 100C, frame assembly 100D) are coupled together.

The plurality of coupling assemblies (e.g., coupling assembly 112) mayinclude latch bolt 114 and latch catch 116 configured to engage latchbolt 114. Each latch catch 116 may include tumbler spring 118 forengaging a recess in latch bolt 114. Further, each latch bolt 114 mayinclude push spring 120 configured to bias the recess of latch bolt 114against tumbler spring 118.

As will be discussed below in greater detail, the multi-piece MEMSelectrical connector assembly (e.g., outer frame 30) may be configuredto be rigidly attached to and wire bound to printed circuit board 12 viaa plurality of wire bond connections, wherein this plurality of wirebond connections may be encapsulated in epoxy to provide added strengthand durability.

Referring also to FIG. 4, there is shown a top view of comb drive sector106 in accordance with various embodiments of the present disclosure.Each comb drive sector (e.g., comb drive sector 106) may include one ormore motion control cantilever assemblies (e.g., motion controlcantilever assemblies 150A, 150B) positioned outside of comb drivesector 106, moveable frame 152, moveable spines 154, fixed frame 156,fixed spines 158, and cantilever assembly 108 that is configured tocouple moving frame 152 to outer periphery 110 of MEMS actuation core34. In this particular configuration, motion control cantileverassemblies 150A, 150B may be configured to prevent y-axis displacementbetween moving frame 152/moveable spines 154 and fixed frame 156/fixedspines 158.

Comb drive sector 106 may include a movable member including moveableframe 152 and multiple moveable spines 154 that are generally orthogonalto moveable frame 152. Comb drive sector 106 may also include a fixedmember including fixed frame 156 and multiple fixed spines 158 that aregenerally orthogonal to fixed frame 156. Cantilever assembly 108 may bedeformable in one direction (e.g., in response to y-axis deflectiveloads) and rigid in another direction (e.g., in response to x-axistension and compression loads), thus allowing for cantilever assembly108 to absorb motion in the y-axis but transfer motion in the x-axis.

Referring also to FIG. 5, there is shown a detail view of portion 160 ofcomb drive sector 106. Moveable spines 154A, 154B may include aplurality of discrete moveable actuation fingers that are generallyorthogonally-attached to moveable spines 154A, 154B. For example,moveable spine 154A is shown to include moveable actuation fingers 162Aand moveable spine 154B is shown to include moveable actuation fingers162B.

Further, fixed spine 158 may include a plurality of discrete fixedactuation fingers that are generally orthogonally-attached to fixedspine 158. For example, fixed spine 158 is shown to include fixedactuation fingers 164A that are configured to mesh and interact withmoveable actuation fingers 162A. Further, fixed spine 158 is shown toinclude fixed actuation fingers 164B that are configured to mesh andinteract with moveable actuation fingers 162B.

Accordingly, various numbers of actuation fingers may be associated with(i.e. coupled to) the moveable spines (e.g., moveable spines 154A, 154B)and/or the fixed spines (e.g., fixed spine 158) of comb drive sector106. As discussed above, each comb drive sector (e.g., comb drive sector106) may include two motion control cantilever assemblies 150A, 150Bseparately placed on each side of comb drive sector 106. Each of the twomotion control cantilever assemblies 150A, 150B may be configured tocouple moveable frame 152 and fixed frame 156, as this configurationenables moveable actuation fingers 162A, 162B to be displaceable in thex-axis with respect to fixed actuation fingers 164A, 164B (respectively)while preventing moveable actuation fingers 162A, 162B from beingdisplaced in the y-axis and contacting fixed actuation fingers 164A,164B (respectively).

While actuation fingers 162A, 162B, 164A, 164B (or at least the centeraxes of actuation fingers 162A, 162B, 164A, 164B) are shown to begenerally parallel to one another and generally orthogonal to therespective spines to which they are coupled, this is for illustrativepurposes only and is not intended to be a limitation of this disclosure,as other configurations are possible. Further and in some embodiments,actuation fingers 162A, 162B, 164A, 164B may have the same widththroughout their length and in other embodiments, actuation fingers162A, 162B, 164A, 164B may be tapered.

Further and in some embodiments, moveable frame 152 may be displaced inthe positive x-axis direction when a voltage potential is appliedbetween actuation fingers 162A and actuation fingers 164A, whilemoveable frame 152 may be displaced in the negative x-axis directionwhen a voltage potential is applied between actuation fingers 162B andactuation fingers 164B.

Referring also to FIG. 6A, there is shown a detail view of portion 200of comb drive sector 106. Fixed spine 158 may be generally parallel tomoveable spine 154B, wherein actuation fingers 164B and actuationfingers 162B may overlap within region 202, wherein the width of overlapregion 202 is typically in the range of 10-50 microns. While overlapregion 202 is described as being in the range of 10-50 microns, this isfor illustrative purposes only and is not intended to be a limitation ofthis disclosure, as other configurations are possible.

Overlap region 202 may represent the distance 204 where the ends ofactuation fingers 162B extends past and overlap the ends of actuationfingers 164B, which are interposed therebetween. In some embodiments,actuation fingers 162B and actuation fingers 164B may be tapered suchthat their respective tips are narrower than their respective bases(i.e., where they are attached to their spines). As is known in the art,various degrees of taper may be utilized with respect to actuationfingers 162B and actuation fingers 164B. Additionally, the overlap ofactuation fingers 162B and actuation fingers 164B provided by overlapregion 202 may help ensure that there is sufficient initial actuationforce when an electrical voltage potential is applied so that MEMSactuation core 34 may move gradually and smoothly without any suddenjumps with varying the applied voltage. The height of actuation fingers162B and actuation fingers 164B may be determined by various aspects ofthe MEMS fabrication process and various design criteria.

Length 206 of actuation fingers 162B and actuation fingers 164B, thesize of overlap region 202, the gaps between adjacent actuation fingers,and actuation finger taper angles that are incorporated into variousembodiments may be determined by various design criteria, applicationconsiderations, and manufacturability considerations, wherein thesemeasurements may be optimized to achieve the required displacementutilizing the available voltage potential.

Cantilever Stress Reduction System (Invention #2)

As discussed above, cantilever assembly 108 may be configured to couplemoving frame 152 of comb drive sector 106 and outer periphery 110 ofMEMS actuation core 34. Referring also to FIGS. 6B-6E, in order tomitigate the impact of any z-axis shock load experienced by cantileverassembly 108, a cantilever stress reduction system may be utilized. Forexample, cantilever assembly 108 may include: intermediary cantileverportion 208; main cantilever arm 210 configured to couple a moveableportion of a micro-electrical-mechanical system (MEMS) actuator 24 andintermediary cantilever portion 208; and a plurality of intermediarylinks (e.g., intermediary links 212, 214, 216, 218) configured to coupleintermediary cantilever portion 208 to a portion ofmicro-electrical-mechanical system (MEMS) actuator 24.

For example, the cantilever stress reduction system shown in FIG. 6B isshown to include intermediary links 212, 214; the cantilever stressreduction system shown in FIG. 6C is shown to include intermediary links212, 214; the cantilever stress reduction system shown in FIG. 6D isshown to include intermediary links 212, 214, 216, 218; and thecantilever stress reduction system shown in FIG. 6E is shown to includeintermediary links 212, 214. Some or all of plurality of intermediarylinks 212, 214, 216, 218 may be coupled to a moveable portion ofmicro-electrical-mechanical system (MEMS) actuator 24 (e.g., moveableframe 152 and moveable spines 154) or a non-moveable portion ofmicro-electrical-mechanical system (MEMS) actuator 24 (e.g., outerperiphery 110)

In some embodiments, main cantilever arm 210 may include a first distalend coupled to the moveable portion (e.g., moveable frame 152 andmoveable spines 154) of micro-electrical-mechanical system (MEMS)actuator 24 and a second distal end coupled to intermediary cantileverportion 208.

Some embodiments of plurality of intermediary links 212, 214, 216, 218may include two intermediary links (e.g., intermediary links 212, 214)configured to be non-parallel to main cantilever arm 210 (as shown inFIGS. 6B, 6C and 6E) or essentially orthogonal to main cantilever arm210 (as shown in FIGS. 6B and 6E). Other embodiments of plurality ofintermediary links 212, 214, 216, 218 may include four intermediarylinks configured to be non-parallel to main cantilever arm 210 (as shownin FIG. 6D).

Specifically, plurality of intermediary links 212, 214, 216, 218 may beconfigured to absorb out-of-plane (z-axis) motion of the moveableportion (e.g., moveable frame 152 and moveable spines 154) ofmicro-electrical-mechanical system (MEMS) actuator 24. For example, someor all of the plurality of intermediary links 212, 214, 216, 218 may beconfigured to torsionally-twist to absorb out-of-plane motion (z-axis)of the moveable portion (e.g., moveable frame 152 and moveable spines154) of micro-electrical-mechanical system (MEMS) actuator 24. Toprovide for additional strength, planar spanning structure 220 may beconfigured to couple an upper surface of intermediary cantilever portion208 to an upper surface of one or more of the plurality of intermediarylinks 212, 214, 216, 218. Planar spanning structure 220 may be made bydepositing a layer of material (e.g., polysilicon, metals (such asaluminum, titanium, copper, tungsten), amorphous diamond, oxides (suchas silicon oxide, aluminum oxide, or other metal oxide), nitrides (suchas silicon nitride, metal nitride), carbides (such as silicon carbide,metal carbide), etc., or combined layers thereof) to span the uppersurface of intermediary cantilever portion 208 and the upper surface ofone or more of the plurality of intermediary links 212, 214, 216, 218.

As discussed above and in order to mitigate the impact of any z-axisshock load experienced by cantilever assembly 108, a cantilever stressreduction system may be utilized. In the implantations shown in FIGS.6A-6E, cantilever assembly 108 is shown to include: intermediarycantilever portion 208; main cantilever arm 210 configured to couple amoveable portion of a micro-electrical-mechanical system (MEMS) actuator24 and intermediary cantilever portion 208; and a plurality ofintermediary links (e.g., intermediary links 212, 214, 216, 218)configured to couple intermediary cantilever portion 208 to a portion ofmicro-electrical-mechanical system (MEMS) actuator 24.

Accordingly, it is understood that other configurations are possible andare considered to be within the scope of this disclosure and claims. Forexample, the above-described cantilever stress reduction system may beutilized on each end of cantilever assembly 108. Accordingly, each endof main cantilever arm 210 may be coupled to an intermediary cantileverportion (e.g., intermediary cantilever portion 208), wherein a first ofthese intermediary cantilever portions may be utilized to couple a firstend of main cantilever arm 210 (of cantilever assembly 108) to movingframe 152 and a second of these intermediary cantilever portions may beutilized to couple a second end of main cantilever arm 210 (ofcantilever assembly 108) to outer periphery 110 of MEMS actuation core34.

Finger Array Snubbing (Invention #1)

As discussed above, micro-electrical-mechanical system (MEMS) actuator24 may include a plurality of actuation fingers, which includes moveableactuation fingers 162B (coupled to moveable frame 152 and moveable spine154B) and fixed actuation fingers 164B (coupled to fixed frame 156 andfixed spines 158). As discussed above, moveable actuation fingers 162Bare displaceable along the x-axis and essentially non-displaceable alongthe y-axis.

Referring also to FIGS. 6F-6H, in order to mitigate the impact of anyz-axis shock load experienced by the plurality of actuation fingers andany deformation experienced by the motion-control cantilevers, fingerarray snubbing system 222 may be utilized to mitigate displacement alongthe z-axis. Micro-electrical-mechanical system (MEMS) actuator 24 mayinclude a first set of actuation fingers (e.g., moveable actuationfingers 162B1, 162B2, 162B3) and a second set of actuation fingers(e.g., fixed actuation fingers 164B1, 164B2, 164B3), wherein theseactuation fingers may be constructed of silicon (or any other suitablematerial).

First spanning structure (e.g., spanning structure 224) configured tocouple at least two fingers (e.g., actuation fingers 162B1, 162B2) offirst set of actuation fingers (e.g., moveable actuation fingers 162B1,162B2, 162B3) while spanning at least one finger (e.g., actuation finger164B1) of second set of actuation fingers (e.g., fixed actuation fingers164B1, 164B2, 164B3). First spanning structure 224 may be constructed ofmetallic material, examples of which may include but are not limited topolysilicon, metals (such as aluminum, titanium, copper, tungsten),amorphous diamond, oxides (such as silicon oxide, aluminum oxide, orother metal oxide), nitrides (such as silicon nitride, metal nitride),carbides (such as silicon carbide, metal carbide), etc., or combinedlayers thereof.

First spanning structure 224 may be configured to span the at least onefinger (e.g., actuation finger 164B1) of second set of actuation fingers(e.g., fixed actuation fingers 164B1, 164B2, 164B3) at a distanceconfigured to define a maximum level of first-axis/first-direction(i.e., z-axis) deflection for the at least one finger (e.g., actuationfinger 164B1) of the second set of actuation fingers (e.g., fixedactuation fingers 164B1, 164B2, 164B3). First spanning structure 224 maybe configured to define a gap between first spanning structure 224 andthe at least one finger (e.g., actuation finger 164B1) of the second setof actuation fingers (e.g., fixed actuation fingers 164B1, 164B2,164B3), wherein this gap is in the range of 0.1 μm and 5 μm.

Second spanning structure 228 may be configured to couple at least twofingers (e.g., actuation fingers 164B2, 164B3) of second set ofactuation fingers (e.g., fixed actuation fingers 164B1, 164B2, 164B3)while spanning at least one finger (e.g., actuation finger 162B3) of thefirst set of actuation fingers (e.g., moveable actuation fingers 162B1,162B2, 162B3). Second spanning structure 228 may be constructed ofmetallic material, examples of which may include but are not limited topolysilicon, metals (such as aluminum, titanium, copper, tungsten),amorphous diamond, oxides (such as silicon oxide, aluminum oxide, orother metal oxide), nitrides (such as silicon nitride, metal nitride),carbides (such as silicon carbide, metal carbide), etc., or combinedlayers thereof.

Second spanning structure 228 may be configured to span the at least onefinger (e.g., actuation finger 162B3) of the first set of actuationfingers (e.g., moveable actuation fingers 162B1, 162B2, 162B3) at adistance configured to define a maximum level offirst-axis/second-direction (i.e., z-axis) deflection for the at leasttwo fingers (e.g., actuation fingers 164B2, 164B3) of the second set ofactuation fingers (e.g., fixed actuation fingers 164B1, 164B2, 164B3).Second spanning structure 228 may be configured to define a gap betweenthe second spanning structure 228 and the at least one finger (e.g.,actuation finger 162B3) of the first set of actuation fingers (e.g.,moveable fingers 162B1, 162B2, 162B3), wherein this gap may be in therange of 0.1 μm and 5 μm.

While manufacturing first spanning structure 224 and second spanningstructure 228, patches of thin film may be deposited on top ofoverlapping areas of the finger arrays (e.g., moveable actuation fingers162B and fixed actuation fingers 164B). Specifically, a patch of thinfilm may be attached to span three fingers (e.g., for first spanningstructure 224, actuation fingers 162B1, 162B2 and 164B1), wherein thethin film is detached from (in this example) actuation finger 164B1 sothat the movable finger (e.g., actuation finger 164B1) may move withinthe tolerated x-axis range.

Accordingly and for first spanning structure 224, moveable actuationfingers 162B1, 162B2 may be prevented from moving downward (i.e., intothe page). And for second spanning structure 228, moveable actuationfinger 162B3 will be prevented from moving upward (i.e., out of thepage).

Sacrificial layers 232 may be constructed of various materials (e.g.,polysilicon, metals, oxides, nitrides, carbides, and polymers (such asPMMA, parylene, etc.)) and may be removed during the release process andmay leave the above-described gap that controls the maximum amount ofz-axis deflection that may be experienced by e.g., moveable actuationfingers 162B1, 162B2, 162B3.

As stated above, examples of micro-electrical-mechanical system (MEMS)actuator 24 may include but are not limited to an in-plane MEMSactuator, an out-of-plane MEMS actuator, and a combinationin-plane/out-of-plane MEMS actuator. Referring also to FIG. 7, there isshown a combination in-plane/out-of-plane MEMS actuator that includesin-plane MEMS actuator 250, with out-of-plane actuator 252 attachedthereto. As discussed above (and as shown in FIG. 3),micro-electrical-mechanical system (MEMS) actuator 24 may include fourcomb drive sectors (e.g., comb drive sector 106), wherein out-of-planeactuator 252 may be located in the center of these comb drive sectors.Accordingly, out-of-plane actuator 252 may be located under in-planeMEMS actuator 250 and/or outer frame 30 of in-plane MEMS actuator 250.

Plurality of electrically conductive flexures 32 may be configured toconduct electrical signal within in-plane MEMS actuator 250 and may alsoprovide electrical signal routing to out-of-plane actuator 252.Plurality of electrically conductive flexures 32 may be highlyconductivity and may be formed of a metal alloy layer (e.g., aluminum,copper, metal and metal alloys) disposed on multiple layers includingbut not limited to polysilicon, silicon oxide, silicon or other suitablesemiconductor surface.

Plurality of electrically conductive flexures 32 may be designed in suchas to provide a low level of stiffness, thus allowing for x-axis andy-axis and/or z-axis movement to provide the degrees of freedom requiredby in-plane MEMS actuator 250 and/or out-of-plane actuator 252.

While the spanning structures (e.g., first spanning structure 224 andsecond spanning structure 228) are shown to be essentially rectangularspanning structures that span a single actuation finger, this is forillustrative purposes only and is not intended to be a limitation ofthis disclosure, as other configurations are possible and are consideredto be within the scope of the disclosure. For example and referring alsoto FIGS. 61-6L, there is shown other implementations of the spanningstructures (e.g., first spanning structure 224 and second spanningstructure 228) that are shaped differently and/or span multipleactuation fingers.

For example and as shown in FIG. 61, there is shown an essentiallyrectangular spanning structure (e.g., spanning structure 234) that isshown to span three actuation fingers (e.g., actuation fingers 235, 236,237). Further and as shown in FIG. 6J, there is shown an essentiallyX-shaped spanning structures (e.g., spanning structure 238) that isshown to span one actuation finger (e.g., actuation finger 239).Additionally and as shown in FIG. 6K, there is shown an essentiallyH-shaped spanning structures (e.g., spanning structure 240) that isshown to span one actuation finger (e.g., actuation finger 241). Furtherand as shown in FIG. 6L, there is shown an essentially X-shaped spanningstructure (e.g., spanning structure 242) that is shown to span threeactuation fingers (e.g., actuation fingers 243, 244, 245).

Referring also to FIG. 8, there is shown a detail view of out-of-planeactuator 252 in accordance with various embodiments of the presentdisclosure. Examples of out-of-plane actuator 252 may include but arenot limited to a piezoelectric actuator. Out-of-plane actuator 252 maybe configured to provide actuation in multiple directions including thedirection orthogonal to the motion provided by in-plane MEMS actuator250 (e.g., the z-axis). Out-of-plane actuator 252 may include centerstage 300 configured to allow for the attachment of e.g., optoelectronicdevice 26 (see FIG. 3). Out-of-plane actuator 252 may also include outerframe 302, intermediate stage 304, intermediate stage 306, actuationbeams 308, 310, 312 and electrical flexures 314. Actuation beams 308,310, 312 may be configured to couple center stage 300, intermediatestage 304, intermediate stage 306 and outer frame 302.

While only one set of electrical flexures is shown, this is forillustrative purposes only and is not intended to be a limitation ofthis disclosure, as other configurations are possible. For example, aset of electrical flexures may also be included between intermediatestages 304, 306, and/or a set of electrical flexures may also beincluded between intermediate stage 306 and center stage 300. Whilecenter stage 300 is shown to be oval in shape, other configurations arepossible and are considered to be within the scope of this disclosure.

Z-axis (i.e., out-of-plane) movement of center stage 300 of out-of-planeactuator 252 may be generated due to the deformation of actuation beams308, 310, 312, which may be formed of a piezoelectric material (e.g.,PZT (lead zirconate titanate), zinc oxide or other suitable material)that may be configured to deflect in response to an electrical signal.Actuation beam 308 and electrical flexure 314 may be configured to meetvarious stiffness requirement and/or allow for the level ofdeformability needed to achieve a desired level of z-axis movement whileprohibiting x-axis and y-axis movement. The quantity of actuation beamsand electrical flexures at each level (i.e., each concentric ring inthis example) may be varied to achieve the desired level of stiffnessand/or flexibility, and provide the required number of electricalconnections.

Actuation beams 308, 310, 312 and/or electrical flexures 314 may includecantilevers and/or hinges (not shown) to enable movement in theout-of-plane (z-axis) direction. As discussed above, piezoelectricmaterial may be used to achieve the desired deformation when anelectrical signal is applied. The various beams (e.g., actuation beams308, 310, 312) and electrical flexures (e.g., electrical flexure 314)may include a metal layer for routing electrical signals.

Center stage 300 may be divided into two or more discrete portions(e.g., center stage portions 300A, 300B), wherein the shape of thesediscrete portions may vary depending upon design criteria. Additionally,intermediate stages 304, 306 may also be divided into two or morediscrete portions. In such a configuration and when an electrical signalis applied to the actuation beams connected to center stage portion 300Aand/or center stage portion 300B, the portion of center stage 300provided with the electrical signal may move out of plane (in thez-axis) to achieve a desired level of roll or pitch.

Referring also to FIG. 9A, there is shown a cross-sectional view of atwo-actuator package in accordance with various embodiments of thepresent disclosure. Out-of-plane actuator 252 may be joined to printedcircuit board 12 at outer frame 302 by epoxy 350 or other suitableadhesive/material. Printed circuit board 12 may form part of package 10in various embodiments. In-plane MEMS actuator 250 may be disposed onout-of-plane actuator 252 and may be bonded to outer frame 302 andcenter stage 300 of out-of-plane actuator 252. Optoelectronic device 26may be disposed on top of in-plane MEMS actuator 250.

Holder assembly 316 (which may include glass window 318) may be disposedon top of printed circuit board 12 or in-plane MEMS actuator 250.Electrical connections 320 from optoelectronic device 26 to the outerperiphery of MEMS in-plane actuator 250 may be achieved by e.g., astandard COB wire bonding process, by a conductive epoxy/paste, by aMEMS bonding process, or by another suitable bonding means. Electricalconnections 322 from outer frame 30 of in-plane MEMS actuator 250 topads 310 of printed circuit board 12 may use the same bonding process asthat used for electrical connections 306.

As is understood, some embodiments of package 10 may not includeout-of-plane actuator 252. In such embodiments, in-plane MEMS actuator250 may be mounted directly to printed circuit board 12 by epoxying orotherwise affixing the fixed frame portions (e.g., fixed frame 156) ofthe comb drive sectors (e.g., comb drive sector 106) and outer frame 30of micro-electrical-mechanical system (MEMS) actuator 24 to printedcircuit board 12.

Referring also to FIG. 9B, there is shown a cross-sectional detail viewof a portion of the two-actuator package shown in FIG. 9A. Forembodiments of package 10 that include out-of-plane actuator 252,out-of-plane actuator 252 may be electrically coupled to componentsoutside of package 10 through conductive epoxy (or paste) disposedwithin passage 352 formed in in-plane MEMS actuator 250 and also throughplurality of electrically conductive flexures 32 of in-plane MEMSactuator 250.

In various embodiments, the electrical routes/signals of out-of-planeactuator 252 may pass through electrical flexures 314 (see FIG. 8) ormay pass through the actuation beam 308, 310, and 312 and throughelectrical contact 354 to be electrically coupled to circuit board 12(not shown in FIG. 9B). Electrical signals may also pass throughin-plane MEMS actuator 250 through passage 352 which may be filled withconductive epoxy, silver paste or an electrical plating to achieve thedesired conduction.

Referring also to FIG. 10, there is shown a cross-sectional view of aportion of out-of-plane actuator 252 (in a deformed position) andin-plane MEMS actuator 250, in accordance with various embodiments ofthe present disclosure. Center stage 300 of “deformed” out-of-planeactuator 252 may be coupled to in-plane MEMS actuator 250, which iscoupled to optoelectronic device 26. Electrical signals may be appliedto actuation beams 308, 310, 312 and may result in the deformation ofout-of-plane actuator 252. The flexibility of plurality of electricallyconductive flexures 32 may be configured to enable three axis movementof in-plane MEMS actuator 250 while achieving the flexibility androbustness requirements of out-of-plane actuator 252.

Z-axis “out-of-plane” movement of out-of-plane actuator 252 may begenerated at least in part due to the deformation of actuation beams308, 310, 312. As shown more clearly in FIG. 11, the actuation beam 308may deform when an electrical signal is applied to the polarizedpiezoelectric material (e.g., PZT). Various suitable piezoelectricmaterials with different polarization pattern and characteristics may beused to achieve the desired level of deformation. While not shown,actuation beams 310, 312 (not shown) may deform similarly to actuationbeam 308. In some embodiments, actuation beam 308 may be a compositematerial (e.g., including upper material 400 and lower material 402),wherein various materials may be used in combination to produce thedesired piezoelectric effect. Further embodiments may utilize differentconfigurations of in-plane MEMS actuator 250 and out-of-plane actuator252 to achieve additional degrees of freedom.

MEMS Camera Package (Invention #3)

As discussed above, some embodiments of package 10 may not includeout-of-plane actuator 252 and in such embodiments, in-plane MEMSactuator 250 may be mounted directly to printed circuit board 12 byepoxying or otherwise affixing the fixed frame portions (e.g., fixedframe 156) of the comb drive sectors (e.g., comb drive sector 106) andouter frame 30 of micro-electrical-mechanical system (MEMS) actuator 24to printed circuit board 12. Accordingly, the following discussionconcerns such a system (i.e., a camera package) that does not include anout-of-plane actuator.

Referring also to FIG. 12, there is shown a cross-sectional view of acamera package (e.g., package 10) that does not include an out-of-planeactuator. Accordingly and for this example, package 10 is only capableof movement is two directions (e.g., x-axis and y-axis).

Package 10 may include micro-electrical-mechanical system (MEMS)actuator 24 that may be configured to be coupled (on a lower surface) toprinted circuit board 12. Printed circuit board 12 may include recess450 for receiving micro-electrical-mechanical system (MEMS) actuator 24.Printed circuit board 12 may include a metal plate 452 to effectuate thecoupling of micro-electrical-mechanical system (MEMS) actuator 24 toprinted circuit board 12. An example of metal plate 452 may include astainless steel plate positioned within recess 450. Specifically, metalplate 452 may be epoxied/attached within recess 450 of printed circuitboard 12 and may allow for the coupling of micro-electrical-mechanicalsystem (MEMS) actuator 24 to a smooth, flat surface on printed circuitboard 12.

An image sensor assembly (e.g., optoelectronic device 26) may be coupledto an upper surface of micro-electrical-mechanical system (MEMS)actuator 24. For example, optoelectronic device 26 may beepoxied/attached to outer periphery 110 of MEMS actuation core 34.Accordingly, by coupling optoelectronic device 26 tomicro-electrical-mechanical system (MEMS) actuator 24, optoelectronicdevice 26 may be moved along the x-axis and the y-axis to effectuatevarious operations (e.g., image stabilization).

A holder assembly (e.g., holder assembly 454) may be coupled to andpositioned with respect to micro-electrical-mechanical system (MEMS)actuator 24, wherein the purpose of holder assembly 454 may be to coverand snub micro-electrical-mechanical system (MEMS) actuator 24. Forexample and instead of positioning holder assembly 454 with respect toprinted circuit board 12, holder assembly 454 may be positioned withrespect to micro-electrical-mechanical system (MEMS) actuator 24.Accordingly and by positioning holder assembly 454 with respect tomicro-electrical-mechanical system (MEMS) actuator 24, anyirregularities associated with printed circuit board 12 may beeliminated.

Autofocus actuator 456 may be coupled to holder assembly 454 and lensassembly 458 may be coupled to autofocus actuator 456. IR filter 460 maybe positioned between autofocus actuator 456 and holder assembly 454 andmay be configured to filter infrared light from the incoming imagebefore it strikes optoelectronic device 26.

Referring also to FIGS. 13A-13B, holder assembly 454 may include one ormore shock impact assemblies (e.g., shock impact assemblies 500)configured to define a maximum amount of z-axis movement formicro-electrical-mechanical system (MEMS) actuator 24 in response to animpact. Specifically, shock impact assemblies 500 may be positionedproximate moveable portions of micro-electrical-mechanical system (MEMS)actuator 24 (e.g., moveable frame 152 and moveable spines 154) so thatz-axis movement of these moveable portions may be controlled. Forexample, the maximum amount of z-axis movement for the moveable portions(e.g., moveable frame 152 and moveable spines 154) ofmicro-electrical-mechanical system (MEMS) actuator 24 may beapproximately 35 micrometers. Further, holder assembly 454 may includeone or more image sensor stop assemblies (e.g., sensor stop assemblies502) configured to snub optoelectronic device 26 and define a maximumamount of z-axis movement for optoelectronic device 26 in response to animpact. For example, the maximum amount of z-axis movement foroptoelectronic device 26 may be approximately 40 micrometers.Specifically, the gap between holder assembly 454 and the image sensorassembly (e.g., optoelectronic device 26) may be approximately 195micrometers, wherein the wirebonding and epoxy may reduce this gap toapproximately 40 micrometers.

Additionally, holder assembly 454 may include one or more clearancetroughs (e.g., clearance troughs 504) configured to provide clearancefor one or more electrical connectors (e.g., plurality of electricallyconductive flexures 32) of micro-electrical-mechanical system (MEMS)actuator 24. Holder assembly 454 may further include one or morestrengthening ribs (e.g., strengthening ribs 506) configured to span theone or more clearance troughs (e.g., clearance troughs 504) and stiffenholder assembly 454. Holder assembly 454 may also include one or morespacer assemblies (e.g., spacer assemblies 508) configured to positionholder assembly 454 with respect to micro-electrical-mechanical system(MEMS) actuator 24. Specifically, spacer assemblies 508 may make contactwith outer frame 30 of micro-electrical-mechanical system (MEMS)actuator 24.

Two-Axis MEMS Camera Package Assembly (Invention #4)

As discussed above, some embodiments of package 10 may not includeout-of-plane actuator 252 and the following discussion concerns such asystem (i.e., a camera package) that does not include an out-of-planeactuator.

Referring also to FIG. 14, method 550 of manufacturing amicro-electrical-mechanical system (MEMS) assembly may include mounting552 micro-electrical-mechanical system (MEMS) actuator 24 to metal plate452. An image sensor assembly (e.g., optoelectronic device 26) may bemounted 554 to micro-electrical-mechanical system (MEMS) actuator 24.The image sensor assembly (e.g., optoelectronic device 26) may beelectrically coupled 556 to micro-electrical-mechanical system (MEMS)actuator 24, thus forming a micro-electrical-mechanical system (MEMS)subassembly.

Mounting 552 micro-electrical-mechanical system (MEMS) actuator 24 tometal plate 452 may include applying 558 epoxy to metal plate 452,positioning 560 micro-electrical-mechanical system (MEMS) actuator 24 onthe epoxy, and curing 562 the epoxy. In other embodiments, othersuitable glues or other adhesives may be used.

Mounting 554 an image sensor assembly (e.g., optoelectronic device 26)to micro-electrical-mechanical system (MEMS) actuator 24 may includeapplying 564 epoxy to micro-electrical-mechanical system (MEMS) actuator24, positioning 566 the image sensor (e.g., optoelectronic device 26) onthe epoxy, and curing 568 the epoxy. In other embodiments, othersuitable glues or other adhesives may be used.

Electrically coupling 556 the image sensor assembly (e.g.,optoelectronic device 26) to the micro-electrical-mechanical system(MEMS) actuator may include wirebonding 570 the image sensor assembly(e.g., optoelectronic device 26) to micro-electrical-mechanical system(MEMS) actuator 24.

The micro-electrical-mechanical system (MEMS) subassembly may be mounted572 to printed circuit board 12. Mounting 572 themicro-electrical-mechanical system (MEMS) subassembly to printed circuitboard 12 may include applying 574 epoxy to printed circuit board 12,positioning 576 the micro-electrical-mechanical system (MEMS)subassembly on the epoxy, and curing 578 the epoxy. In otherembodiments, other suitable glues or other adhesives may be used.Printed circuit board 12 may include an opening (or a recess) to variousdepths and (in some embodiments) the epoxy may be applied to an uppersurface of printed circuit board 12.

The micro-electrical-mechanical system (MEMS) subassembly may beelectrically coupled 580 to printed circuit board 12. Electricallycoupling 580 the micro-electrical-mechanical system (MEMS) subassemblyto printed circuit board 12 may include wirebonding 582 themicro-electrical-mechanical system (MEMS) subassembly to printed circuitboard 12. Electrically coupling 580 the micro-electrical-mechanicalsystem (MEMS) subassembly to printed circuit board 12 may furtherinclude encapsulating 584 the wirebonding in epoxy.

Holder assembly 454 may be mounted 586 to themicro-electrical-mechanical system (MEMS) subassembly. Mounting 586holder assembly 454 to the micro-electrical-mechanical system (MEMS)subassembly may include applying 588 epoxy to printed circuit board 12,positioning 590 the holder assembly on the epoxy, and curing 592 theepoxy. For example, holder assembly 454 may be placed on top of themicro-electrical-mechanical system (MEMS) subassembly and epoxy may beapplied between holder assembly 454 and printed circuit board 12 (tocouple holder assembly 454 to the micro-electrical-mechanical system(MEMS) subassembly). This epoxy may be applied in the gap betweenprinted circuit board 12 and holder assembly 454 once holder assembly454 is positioned on top of the micro-electrical-mechanical system(MEMS) subassembly. The spacer assemblies 508 may be used as a referencesurface to make contact with the micro-electrical-mechanical system(MEMS) subassembly. In other embodiments, other suitable glues or otheradhesives may be used.

Three-Axis MEMS Camera Package Assembly

As discussed above, some embodiments of package 10 may includeout-of-plane actuator 252 and the following discussion concerns such asystem (i.e., a camera package) that includes an out-of-plane actuator.

Referring also to FIG. 15, method 600 of manufacturing amicro-electrical-mechanical system (MEMS) assembly may include applying602 epoxy on printed circuit board 12 for bonding outer frame 302 ofout-of-plane actuator 252 to printed circuit board 12. In otherembodiments, other suitable glues or other adhesives may be used.Printed circuit board 12 may include an opening (or a recess) to variousdepths and (in some embodiments) the epoxy may be applied to an uppersurface of printed circuit board 12.

Out-of-plane actuator 252 may be a z-axis piezoelectric actuator and maybe mounted 604 (directly or indirectly) on printed circuit board 12. Inother embodiments, there may be another component disposed betweenout-of-plane actuator 252 and printed circuit board 12. After the epoxyis cured, outer frame 302 of out-of-plane actuator 252 may be applied toprinted circuit board 12. Outer frame 302 of out-of-plane actuator 252may be constructed of a silicon material (which may have a thermalexpansion coefficient that matches printed circuit board 12).Additionally/alternatively, outer frame 302 may be constructed of aflexural material that compensates for any mismatch in thermalexpansion.

After the assembly of out-of-plane actuator 252, epoxy may be applied606 on center stage 300 and outer frame 302 of out-of-plane actuator252. In other embodiments, other suitable glues or other adhesives maybe used. In-plane MEMS actuator 250 may be placed 608 on out-of-planeactuator 252 and the epoxy may be allowed to cure. After curing,in-plane MEMS actuator 250 may be bonded to out-of-plane actuator 252 onprinted circuit board 12.

Out-of-plane actuator 252 may include conductive traces that passthrough in-plane MEMS actuator 250 (as described above). Conductiveepoxy or similar material may be provided 610 on associated holes onin-plane MEMS actuator 250 to connect and electrically couple toout-of-plane actuator 252, wherein the conductive epoxy is subsequentlyallowed to cure.

Thermal epoxy (or another suitable adhesive) may be applied 612 on anouter periphery of in-plane MEMS actuator 250, and then optoelectronicdevice 26 may be joined 614 to in-plane MEMS actuator 250. Varioussuitable epoxies or other adhesives may be used.

After curing to affix optoelectronic device 26 to in-plane MEMS actuator250, electrical connections through standard COB process (or othersuitable methods) may be completed 616. Protective epoxy may be applied618 to the electrical joints to enhance the strength and robustness ofthe bond. Other protective materials may be used in other embodiments.

If there are particles on optoelectronic device 26, these particles maybe removed by vibrating 620 optoelectronic device 154, wherein holder302 (which may include glass window 304) may be mounted 622 onto circuitboard 12 or in-plane MEMS actuator 250.

Zipper Actuator (Invention #5)

The above discussion concerned the use of e.g.,micro-electrical-mechanical system (MEMS) actuator 24 that includes aplurality of actuation fingers, which includes moveable actuationfingers 162B (coupled to moveable frame 152 and moveable spine 154B) andfixed actuation fingers 164B (coupled to fixed frame 156 and fixedspines 158). While the use of such a finger-based MEMS actuator providesa high level of granularity and controllability, often times, suchgranularity and controllability is not needed. For example, certainsystems only require that a system be in one of two states (e.g.,on/off, open/closed, up/down). Examples of such a system may include butare not limited to a shutter control system (i.e., the shutter is eitheropened or closed) and a telephoto lens system (i.e., the lens is eitherin standard mode or zoom mode).

In such situations, a zipper actuator may be used, as zipper actuatorsprovide good performance with systems that require only two suchpositions. Referring also to FIG. 16, micro-electrical-mechanical system(MEMS) assembly 650 may include stationary stage 652 and rigid stage654. At least one flexure 656 may be configured to slidably couplestationary stage 652 and rigid stage 654, thus allowing rigid stage 654to be slidably displaced along the x-axis. At least one flexibleelectrode 658 is coupled to and essentially orthogonal to one ofstationary stage 652 and rigid stage 654. And at least one rigidelectrode 660 is coupled to and essentially orthogonal to the other ofstationary stage 652 and rigid stage 654.

The at least one flexible electrode 658 may be configured to beenergized at a first voltage potential and the at least one rigidelectrode 660 may be configured to be energized at a second voltagepotential. Accordingly and by applying a voltage potential acrosselectrodes 658, 660, an electric field may be generated betweenelectrodes 658, 660 that will draw electrodes 658, 660 towards eachother. Specifically and in the embodiment shown in FIG. 16, flexibleelectrode 658 will be drawn towards rigid electrode 660. And as flexibleelectrode 658 is flexible, flexible electrode 658 will bend toward rigidelectrode 660 until the point at which the lower end of flexibleelectrode 658 contacts the lower end of rigid electrode 660. At thispoint, flexure 656 may flex and allow rigid stage 654 to move towardrigid electrode 660, allowing the entirety of flexible electrode 658 to“zipper up” against rigid electrode 660 and close any gap therebetween.Electrodes 658, 660 may each include insulation layer 662 so that whenelectrodes 658, 660 initially contact each other, they do not short out.This, in turn, will allow the above-described voltage potential to bemaintained and allow flexible electrode 658 to fully engage rigidelectrode 660.

As discussed above, micro-electrical-mechanical system (MEMS) assembly650 may include at least one flexible electrode 658 and at least onerigid electrode 660. Accordingly, micro-electrical-mechanical system(MEMS) assembly 650 may include two or more flexible electrodes (thatare coupled and essentially orthogonal to one of the stationary stageand the rigid stage) and two or more rigid electrodes (that are coupledand essentially orthogonal to the other of the stationary stage and therigid stage). For example, FIG. 17A shows an embodiment ofmicro-electrical-mechanical system (MEMS) assembly 650 that includes tworigid electrodes (e.g., rigid electrodes 700, 702) and two flexibleelectrode (e.g., flexible electrodes 704, 706).

Typically, the flexible electrodes (e.g., flexible electrodes 658, 704,706) may be generally straight in shape (as shown in FIGS. 16, 17A).However and as shown in FIG. 17B, these flexible electrodes may begenerally curved in shape (e.g., flexible electrodes 708, 710) and maybe curved toward rigid electrodes 712, 714.

Additionally/alternatively, while the rigid electrodes (e.g., 660, 700,702, 712, 714) are shown to be generally rectangular in shape, this isfor illustrative purposes only and is not intended to be a limitation ofthis disclosure, as other configurations are possible. For example andas shown in FIG. 17C, these rigid electrode (e.g., rigid electrodes 716,718) may include at least one surface that is not orthogonal to thestationary stage and/or the rigid stage. For example, rigid electrodes716, 718 are shown to be somewhat pyramidal in shape, where the portionproximate the stage to which it is attached in comparatively wider andis angled toward flexible electrodes 720, 722.

In order to enhance the utility of micro-electrical-mechanical system(MEMS) assembly 650, micro-electrical-mechanical system (MEMS) assembly650 may include a plurality of assemblies that may be arranged in aseries configuration (as shown in FIG. 18A) to enhances the maximumplacement of the rigid (i.e., moveable) stages. Additionally,micro-electrical-mechanical system (MEMS) assembly 650 may include aplurality of assemblies that may be arranged in a parallel configurationto enhance the strength/power of the rigid (i.e., moveable) stagesand/or in a parallel-series configuration (as shown in FIG. 18B) toenhances both the maximum displacement and the strength/power of therigid (i.e., moveable) stages.

Slidable Connection Assemblies (Invention #7)

As is known in the art, various etching processes may be utilized whenmanufacturing MEMS devices (e.g., micro-electrical-mechanical system(MEMS) actuator 24), wherein dozens of these MEMS devices may be etchedinto a single silicon wafer. Automated machinery and assembly robots maybe utilized to retrieve these MEMS devices from the wafer and performthe above-described assembly processes. Accordingly, it may be desirableto include some form of structure on the wafer that holds these MEMSdevices in their appropriate positions on the wafer until they areneeded for assembly, at which point, this structure should allow for theeasy removal of these MEMS devices from the wafer.

Referring also to FIGS. 19A-19C, there is shown one implementation of aslidable connection assembly that may be used to temporarily hold a MEMSdevice in the appropriate position on a wafer until the MEMS device isneeded for e.g., assembly. Accordingly, the micro-electrical-mechanicalsystem (MEMS) device (e.g., micro-electrical-mechanical system (MEMS)actuator 24) may include one or more slidable connection assemblies(e.g., slidable connection assemblies 750) for releasably coupling themicro-electrical-mechanical system (MEMS) device to the wafer (e.g.,wafer 752) from which the micro-electrical-mechanical system (MEMS)device was made. Specifically, the slidable connection assemblies (e.g.,slidable connection assemblies 750) may be manufactured at the same timeas the micro-electrical-mechanical system (MEMS) device (e.g.,micro-electrical-mechanical system (MEMS) actuator 24) and may be madefrom the same wafer (e.g., wafer 752) that themicro-electrical-mechanical system (MEMS) device (e.g.,micro-electrical-mechanical system (MEMS) actuator 24) is made from.Accordingly, the one or more slidable connection assemblies (e.g.,slidable connection assemblies 750) may include a portion of wafer 752(e.g., a supporting pillar on wafer 752).

As discussed above, micro-electrical-mechanical system (MEMS) actuator24 may include MEMS actuation core 34 and a MEMS electrical connectorassembly (e.g., outer frame 30) electrically coupled to MEMS actuationcore 34 and configured to be electrically coupled to a printed circuitboard (e.g., printed circuit board 12).

The one or more slidable connection assemblies (e.g., slidableconnection assemblies 750) may be any portion of the MEMS device that isbeing positioned by slidable connection assemblies 750. For example,slidable connection assemblies 750 may be a portion of MEMS actuationcore 34 and/or a portion of the MEMS electrical connector (e.g., outerframe 30).

The one or more slidable connection assemblies (e.g., slidableconnection assemblies 750) may be configured to allow for the easyremoval of the micro-electrical-mechanical system (MEMS) device (e.g.,micro-electrical-mechanical system (MEMS) actuator 24) from wafer 752when needed for assembly but (up to that point) securely position themicro-electrical-mechanical system (MEMS) device (e.g.,micro-electrical-mechanical system (MEMS) actuator 24) on wafer 752.

Accordingly, the one or more slidable connection assemblies (e.g.,slidable connection assemblies 750) may include one or more fingerassemblies (e.g., device finger assemblies 754) on themicro-electrical-mechanical system (MEMS) device (e.g.,micro-electrical-mechanical system (MEMS) actuator 24). Device fingerassemblies 754 may be sized so that they do not extend past theappropriate edge (e.g., edge 756) of e.g., micro-electrical-mechanicalsystem (MEMS) actuator 24, thus allowing micro-electrical-mechanicalsystem (MEMS) actuator 24 to tightly abut or lay flat upon anotherdevice/system.

The one or more slidable connection assemblies (e.g., slidableconnection assemblies 750) may also include one or more fingerassemblies (e.g., wafer finger assemblies 758) on wafer 752. The one ormore slidable connection assemblies (e.g., slidable connectionassemblies 750) may also include one or more socket assemblies (e.g.,wafer socket assemblies 760) on wafer 752 that are configured to receivethe one or more finger assemblies (e.g., device finger assemblies 754)on the micro-electrical-mechanical system (MEMS) device (e.g.,micro-electrical-mechanical system (MEMS) actuator 24).

The one or more socket assemblies (e.g., wafer socket assemblies 760) onwafer 752 may include a spanning structure (e.g., wafer spanningstructure 762) configured to span at least two fingers (chosen fromwafer finger assemblies 758) on wafer 752, thus forming the one or moresocket assemblies (e.g., wafer socket assemblies 760) therebetween.

The one or more slidable connection assemblies (e.g., slidableconnection assemblies 750) may also include one or more socketassemblies (e.g., device socket assemblies 764) on themicro-electrical-mechanical system (MEMS) device (e.g.,micro-electrical-mechanical system (MEMS) actuator 24) that areconfigured to receive the one or more finger assemblies (e.g., waferfinger assemblies 758) on wafer 752.

The one or more socket assemblies (e.g., device socket assemblies 764)on the micro-electrical-mechanical system (MEMS) device (e.g.,micro-electrical-mechanical system (MEMS) actuator 24) may include aspanning structure (e.g., device spanning structure 766) that isconfigured to span at least two fingers (chosen from device fingerassemblies 754) of the micro-electrical-mechanical system (MEMS) device(e.g., micro-electrical-mechanical system (MEMS) actuator 24), thusforming the one or more socket assemblies (e.g., device socketassemblies 764) therebetween.

While manufacturing spanning structures 762, 766, patches of thin filmmay be deposited on top of overlapping areas of the fingers (e.g.,device finger assemblies 754 and wafer finger assemblies 758).Specifically, a patch of thin film may be attached to span three fingers(e.g., for wafer spanning structure 762, one device finger assembly andtwo wafer finger assemblies), wherein the film is detached from (in thisexample) the one device finger assembly so that the device fingerassembly may be removed from the appropriate wafer socket assembly 760.Sacrificial layers 768 may be constructed of poly silicon material andmay be removed during the release process and may leave gap 770 thatallows for the removal of the device finger assembly from theappropriate wafer socket assembly 760.

General:

In general, the various operations of method described herein may beaccomplished using or may pertain to components or features of thevarious systems and/or apparatus with their respective components andsubcomponents, described herein.

The presence of broadening words and phrases such as “one or more,” “atleast,” “but not limited to” or other like phrases in some instancesshall not be read to mean that the narrower case is intended or requiredin instances where such broadening phrases may be absent.

Additionally, the various embodiments set forth herein are described interms of example block diagrams, flow charts and other illustrations. Aswill become apparent to one of ordinary skill in the art after readingthis document, the illustrated embodiments and their variousalternatives can be implemented without confinement to the illustratedexamples. For example, block diagrams and their accompanying descriptionshould not be construed as mandating a particular architecture orconfiguration.

While various embodiments of the present disclosure have been describedabove, it should be understood that they have been presented by way ofexample only, and not of limitation. Likewise, the various diagrams maydepict an example architectural or other configuration for thedisclosure, which is done to aid in understanding the features andfunctionality that can be included in the disclosure. The disclosure isnot restricted to the illustrated example architectures orconfigurations, but the desired features can be implemented using avariety of alternative architectures and configurations. Indeed, it willbe apparent to one of skill in the art how alternative functional,logical or physical partitioning and configurations can be implementedto implement the desired features of the present disclosure.Additionally, with regard to flow diagrams, operational descriptions andmethod claims, the order in which the steps are presented herein shallnot mandate that various embodiments be implemented to perform therecited functionality in the same order unless the context dictatesotherwise.

Although the disclosure is described above in terms of various exampleembodiments and implementations, it should be understood that thevarious features, aspects and functionality described in one or more ofthe individual embodiments are not limited in their applicability to theparticular embodiment with which they are described, but instead can beapplied, alone or in various combinations, to one or more of the otherembodiments of the disclosure, whether or not such embodiments aredescribed and whether or not such features are presented as being a partof a described embodiment. Thus, the breadth and scope of the presentdisclosure should not be limited by any of the above-described exampleembodiments, and it will be understood by those skilled in the art thatvarious changes and modifications to the previous descriptions may bemade within the scope of the claims.

As will be appreciated by one skilled in the art, the present disclosuremay be embodied as a method, a system, or a computer program product.Accordingly, the present disclosure may take the form of an entirelyhardware embodiment, an entirely software embodiment (includingfirmware, resident software, micro-code, etc.) or an embodimentcombining software and hardware aspects that may all generally bereferred to herein as a “circuit,” “module” or “system.” Furthermore,the present disclosure may take the form of a computer program producton a computer-usable storage medium having computer-usable program codeembodied in the medium.

Any suitable computer usable or computer readable medium may beutilized. The computer-usable or computer-readable medium may be, forexample but not limited to, an electronic, magnetic, optical,electromagnetic, infrared, or semiconductor system, apparatus, device,or propagation medium. More specific examples (a non-exhaustive list) ofthe computer-readable medium may include the following: an electricalconnection having one or more wires, a portable computer diskette, ahard disk, a random access memory (RAM), a read-only memory (ROM), anerasable programmable read-only memory (EPROM or Flash memory), anoptical fiber, a portable compact disc read-only memory (CD-ROM), anoptical storage device, a transmission media such as those supportingthe Internet or an intranet, or a magnetic storage device. Thecomputer-usable or computer-readable medium may also be paper or anothersuitable medium upon which the program is printed, as the program can beelectronically captured, via, for instance, optical scanning of thepaper or other medium, then compiled, interpreted, or otherwiseprocessed in a suitable manner, if necessary, and then stored in acomputer memory. In the context of this document, a computer-usable orcomputer-readable medium may be any medium that can contain, store,communicate, propagate, or transport the program for use by or inconnection with the instruction execution system, apparatus, or device.The computer-usable medium may include a propagated data signal with thecomputer-usable program code embodied therewith, either in baseband oras part of a carrier wave. The computer usable program code may betransmitted using any appropriate medium, including but not limited tothe Internet, wireline, optical fiber cable, RF, etc.

Computer program code for carrying out operations of the presentdisclosure may be written in an object oriented programming languagesuch as Java, Smalltalk, C++ or the like. However, the computer programcode for carrying out operations of the present disclosure may also bewritten in conventional procedural programming languages, such as the“C” programming language or similar programming languages. The programcode may execute entirely on the user's computer, partly on the user'scomputer, as a stand-alone software package, partly on the user'scomputer and partly on a remote computer or entirely on the remotecomputer or server. In the latter scenario, the remote computer may beconnected to the user's computer through a local area network/a widearea network/the Internet (e.g., network 18).

The present disclosure is described with reference to flowchartillustrations and/or block diagrams of methods, apparatus (systems) andcomputer program products according to embodiments of the disclosure. Itwill be understood that each block of the flowchart illustrations and/orblock diagrams, and combinations of blocks in the flowchartillustrations and/or block diagrams, may be implemented by computerprogram instructions. These computer program instructions may beprovided to a processor of a general purpose computer/special purposecomputer/other programmable data processing apparatus, such that theinstructions, which execute via the processor of the computer or otherprogrammable data processing apparatus, create means for implementingthe functions/acts specified in the flowchart and/or block diagram blockor blocks.

These computer program instructions may also be stored in acomputer-readable memory that may direct a computer or otherprogrammable data processing apparatus to function in a particularmanner, such that the instructions stored in the computer-readablememory produce an article of manufacture including instruction meanswhich implement the function/act specified in the flowchart and/or blockdiagram block or blocks.

The computer program instructions may also be loaded onto a computer orother programmable data processing apparatus to cause a series ofoperational steps to be performed on the computer or other programmableapparatus to produce a computer implemented process such that theinstructions which execute on the computer or other programmableapparatus provide steps for implementing the functions/acts specified inthe flowchart and/or block diagram block or blocks.

The flowcharts and block diagrams in the figures may illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods and computer program products according to variousembodiments of the present disclosure. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof code, which comprises one or more executable instructions forimplementing the specified logical function(s). It should also be notedthat, in some alternative implementations, the functions noted in theblock may occur out of the order noted in the figures. For example, twoblocks shown in succession may, in fact, be executed substantiallyconcurrently, or the blocks may sometimes be executed in the reverseorder, depending upon the functionality involved. It will also be notedthat each block of the block diagrams and/or flowchart illustrations,and combinations of blocks in the block diagrams and/or flowchartillustrations, may be implemented by special purpose hardware-basedsystems that perform the specified functions or acts, or combinations ofspecial purpose hardware and computer instructions.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present disclosure has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the disclosure in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the disclosure. Theembodiment was chosen and described in order to best explain theprinciples of the disclosure and the practical application, and toenable others of ordinary skill in the art to understand the disclosurefor various embodiments with various modifications as are suited to theparticular use contemplated.

A number of implementations have been described. Having thus describedthe disclosure of the present application in detail and by reference toembodiments thereof, it will be apparent that modifications andvariations are possible without departing from the scope of thedisclosure defined in the appended claims.

What is claimed is:
 1. A method of manufacturing amicro-electrical-mechanical system (MEMS) assembly comprising: mountinga MEMS actuator to a metal plate, wherein mounting the MEMS actuator tothe metal plate includes, applying epoxy to the metal plate, positioningthe MEMS actuator on the epoxy, and curing the epoxy; mounting an imagesensor assembly to the MEMS actuator; and electrically coupling theimage sensor assembly to the MEMS actuator, thus forming a MEMSsubassembly.
 2. The method of manufacturing the MEMS assembly of claim 1wherein mounting the image sensor assembly to the MEMS actuatorincludes: applying epoxy to the MEMS actuator; positioning the imagesensor on the epoxy; and curing the epoxy.
 3. The method ofmanufacturing the MEMS assembly of claim 1 wherein electrically couplingthe image sensor assembly to the MEMS actuator includes: wirebonding theimage sensor assembly to the MEMS actuator.
 4. The method ofmanufacturing the MEMS assembly of claim 1 further comprising: mountingthe MEMS subassembly to a printed circuit board.
 5. The method ofmanufacturing the MEMS assembly of claim 4 wherein mounting the MEMSsubassembly to the printed circuit board includes: applying epoxy to theprinted circuit board; positioning the MEMS subassembly on the epoxy;and curing the epoxy.
 6. The method of manufacturing the MEMS assemblyof claim 4 further comprising: electrically coupling the MEMSsubassembly to the printed circuit board.
 7. The method of manufacturingthe MEMS assembly of claim 6 wherein electrically coupling the MEMSsubassembly to the printed circuit board includes: wirebonding the MEMSsubassembly to the printed circuit board.
 8. The method of manufacturingthe MEMS assembly of claim 7 wherein electrically coupling the MEMSsubassembly to the printed circuit board further includes: encapsulatingthe wirebonding in epoxy.
 9. The method of manufacturing the MEMSassembly of claim 1 further comprising: mounting a holder assembly tothe MEMS subassembly.
 10. The method of manufacturing the MEMS assemblyof claim 9 wherein mounting the holder assembly to the MEMS subassemblyincludes: applying epoxy to the printed circuit board; positioning theholder assembly on the epoxy; and curing the epoxy.
 11. A method ofmanufacturing a micro-electrical-mechanical system (MEMS) assemblycomprising: mounting a MEMS actuator to a metal plate, wherein mountingthe MEMS actuator to the metal plate includes, applying epoxy to themetal plate, positioning the MEMS actuator on the epoxy, and curing theepoxy; mounting an image sensor assembly to the MEMS actuator;electrically coupling the image sensor assembly to the MEMS actuator,thus forming a MEMS subassembly; mounting the MEMS subassembly to aprinted circuit board; and electrically coupling the MEMS subassembly tothe printed circuit board.
 12. The method of manufacturing the MEMSassembly of claim 11 wherein mounting the image sensor assembly to theMEMS actuator includes: applying epoxy to the MEMS actuator; positioningthe image sensor on the epoxy; and curing the epoxy.
 13. The method ofmanufacturing the MEMS assembly of claim 11 wherein electricallycoupling the image sensor assembly to the MEMS actuator includes:wirebonding the image sensor assembly to the MEMS actuator.
 14. Themethod of manufacturing the MEMS assembly of claim 11 wherein mountingthe MEMS subassembly to the printed circuit board includes: applyingepoxy to the printed circuit board; positioning the MEMS subassembly onthe epoxy; and curing the epoxy.
 15. The method of manufacturing theMEMS assembly of claim 11 wherein electrically coupling the MEMSsubassembly to the printed circuit board includes: wirebonding the MEMSsubassembly to the printed circuit board; and encapsulating thewirebonding in epoxy.
 16. The method of manufacturing the MEMS assemblyof claim 11 further comprising: mounting a holder assembly to the MEMSsubassembly.
 17. The method of manufacturing the MEMS assembly of claim16 wherein mounting the holder assembly to the MEMS subassemblyincludes: applying epoxy to the printed circuit board; positioning theholder assembly on the epoxy; and curing the epoxy.
 18. A method ofmanufacturing a micro-electrical-mechanical system (MEMS) assemblycomprising: mounting a MEMS actuator to a metal plate, wherein mountingthe MEMS actuator to the metal plate includes, applying epoxy to themetal plate, positioning the MEMS actuator on the epoxy, and curing theepoxy; mounting an image sensor assembly to the MEMS actuator;electrically coupling the image sensor assembly to the MEMS actuator,thus forming a MEMS subassembly; mounting the MEMS subassembly to aprinted circuit board; electrically coupling the MEMS subassembly to theprinted circuit board; and mounting a holder assembly to the MEMSsubassembly.